[Electrics & Electronics][Report of Honor] Academician Ernest S. KUH to receive Kirchhoff Award at IEEE Circuits and Systems Symposium in Taipei

[Electrics & Electronics][Report of Honor] Academician Ernest S. KUH to receive Kirchhoff Award at IEEE Circuits and Systems Symposium in Taipei (Chinese Version)

In the Academia Sinica's Newsletter (2009/05/22) it is reported that Academician Ernest S. KUH will receive the Kirchhoff Award on 26th-May at the annual 2009 IEEE Symposium on Circuits and Systems which is being held this year in Taipei International Conference Center (from 24th- to 27th-May, 2009), sponsored by National Cheng Kung University. Dr. KUH will participate the conference and is being honored for his “contributions to Circuits and Systems, and Electronic Design Automation.”

Dr. KUH is an engineer who has worked on Electric Circuit Theory and Computer-Aided Design for very-large-scale-integration (VLSI) Circuits and Systems. His most recent contributions include the development of timing-driven physical design tools for submicron integrated circuit (IC) and multichip modules (MCM), and an accurate and efficient circuit and interconnect simulator works which have yielded software programs useful for industrial and academic researchers. He holds the William S. Floyd, Jr. Professor Emeritus in Engineering and Professor in the Graduate School at the University of California, Berkeley.

The IEEE Kirchhoff Award, as the newsletter introduced, honors the 19th Century German physicist Gustav Robert Kirchhoff who contributed to the fundamental understanding of electrical circuits, spectroscopy, and the emission of black-body radiation by heated objects. Each year, the IEEE headquarter selects one distinguished scholar, who has contributed the most in circuits and systems in the world.


Media Contact:
Mei-Hui LIN, Public Relations Office, Central Office of Administration, Academia Sinica
mhlin313@gate.sinica.edu.tw (Tel) 886-2-2789-8821, (Fax) 886-2-2782-1551, (M) 0921-845-234


Reference:
Academia Sinica Newsletter 2009/05/22



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