[IC Design] TSMC and NTU Jointly Developed the Globally First 40-nano 3D TV Chip

[IC Design] TSMC and NTU Jointly Developed the Globally First 40-nano 3D TV Chip (Chinese Version)

NTU Newsletter (Issue 1038) NTU and TSMC presented the result of their cooperation – the first 40-nano 3D TV chip in the world, with which we can enjoy more refined and diverse video experience. The result of the cooperation between NTU and TSMC entailed several big breakthroughs in video processing, semiconductor processing and 3D technology, and the relevant findings will be presented in ISSCC.

The present 3D technology simulates the visual mechanism of the perspective difference between left and right eye of human. With such a simulation, the audience can enjoy 3D video experience but only in certain angles. The 3D TV chip developed by NTU DSP/IC Design Lab allows the audience to see 3D images from various angles in any position, as if the image belongs to a real entity in front of the audience. Besides, the chip is also provided with functions such as HDTV and 3DTV and elevates the resolution to four times of Full-HD.

NTU DSP/IC Design Lab has begun the cooperation with TSMC since 2008. With the cooperation, the researchers at the Lab can enjoy TSMC's advanced semiconductor processing technology, and several results of the cooperation have been presented in ISSCC. In February, 2010, NTU became the first academic institution in the world which can develop chips with TSMC's 40-nano wafer processing technology. The lately developed 3D TV chip was developed with such an advanced processing technology.


Further Information:
NTU Newsletter Issue 1038 (Chinese)

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National Science Council International Cooperation Sci-Tech Newsbrief
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